1. 2. 3. material content data sheet sales product name saf-xc824mt-1fgi aa issued 29. august 2013 ma# MA000841904 package pg-dso-20-45 weight* 587.78 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.299 0.73 0.73 7315 7315 leadframe inorganic material phosphorus 7723-14-0 0.047 0.01 81 non noble metal zinc 7440-66-6 0.190 0.03 323 non noble metal iron 7439-89-6 3.797 0.65 6460 non noble metal copper 7440-50-8 154.185 26.23 26.92 262316 269180 wire noble metal gold 7440-57-5 0.651 0.11 0.11 1107 1107 encapsulation organic material carbon black 1333-86-4 0.835 0.14 1420 plastics epoxy resin - 38.401 6.53 65333 inorganic material silicondioxide 60676-86-0 378.170 64.34 71.01 643383 710136 leadfinish non noble metal tin 7440-31-5 4.487 0.76 0.76 7633 7633 plating noble metal silver 7440-22-4 0.800 0.14 0.14 1361 1361 glue plastics epoxy resin - 0.480 0.08 817 noble metal silver 7440-22-4 1.441 0.25 0.33 2451 3268 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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